India's Prime Minister opened commercial production lines at two chip plants on 17 September, CDIL Semiconductor in Mohali for discrete devices and Suchi Semicon in Surat for packaging, the government said [1].
That makes 5 operational assembly and packaging units out of the 12 approved under its first semiconductor programme, Semicon 1.0, according to the release. The other three are Micron, Kaynes and CG Semi [1].
The government put the budget of the India Semiconductor Mission at $13.5 billion for its second phase, Semicon 2.0, up from $8 billion in the first [1].
What it covers
Units approved under Semicon 1.0, the programme that subsidises chip plants in India. The five operating so far are assembly, testing and packaging plants (ATMP and OSAT), which put finished chips into packages [1].
Semicon 2.0 has six pillars: design, equipment and materials, fabs, advanced packaging, applied research and talent [1].
The release says 70,000 design engineers have been trained under Semicon 1.0, and design software deployed at more than 500 organisations [1].
What it does not tell you
How much the plants produce, or for whom. The release gives no output figures [1].
When the approved wafer fabs, which make the chips themselves, will start production. None of the five operating units is a fab [1].
It is the government's account of its own programme, published at the industry's trade show [1].
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