India's Union Cabinet approved Semicon 2.0 on 15 July, a second phase of support for the country's semiconductor industry with a total budget outlay of ₹1,27,500 crore [1].
It is built on six pillars: chip design; machines and materials; more fabs; packaging (ATMP and OSAT); research and development; and talent [1].
Companies making or researching chipmaking machines, and those making the materials, chemicals and gases it needs, will be incentivised, according to the release [1].
What it covers
The government says 12 manufacturing units approved under the first programme, Semicon 1.0, add up to over ₹1.64 lakh crore of investment [1].
They are a silicon fab, a silicon carbide fab, a gallium nitride micro-LED display fab and nine packaging units [1].
Three of them, Micron, Kaynes and CG Semi, had started commercial production. India's first fab is scheduled to be commissioned in 2028 [1].
It says 24 chip design projects from start-ups and small firms have been approved for support, and around 68,000 students trained on chip-design software at 315 universities [1].
What it does not tell you
How the ₹1,27,500 crore will be divided between the pillars, or over how many years. The release does not say [1].
The progress figures are the government's own account of its programme [1].
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